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SDI06K
Characteristic
● Lead-free compatible.
● High Tg Halogen-free, Tg 220℃ (TMA).
● Low Dk & Low Loss.
● Lower X/Y/Z-axis CTE.
Application Area
Smart phone, NB,Tablet, Instrumentation, VCR, TV, Electronic Game Machine, CommunicationEquipment, Automotive electronics, etc..
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 260 |
| 2.4.24 | TMA | 220 | ||
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 420 |
|
T288 |
2.4.24.1 | TMA | min |
＞60 |
| T260 |
2.4.24.1 |
TMA |
min |
＞60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 25-30 |
| 50-260℃ | % | 1.4 | ||
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50, RC50% | - | 4.0 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50, RC50% |
- | 0.0040 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 4.76×108 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 1.84×107 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 181 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | ＞45 |
|
Peel Strength (H Oz) |
2.4.8 |
A |
N/mm |
0.95 |
|
Flexural Strength (LW/CW) |
2.4.4 |
A |
GPa |
24/ 23 |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.15 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
Remarks: 1. All the typical value is based on the1.0mm specimen. (*) is based on 0.10mm(1x2116) specimen.
2. All the typical value listed aboveis for your reference only, please turn to Shengyi Technology Co., Ltd fordetailed information, and all rights from this data sheet are reserved byShengyi Technology Co., Ltd.
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