SDI03K
特点
● 无铅兼容
● 高Tg无卤，Tg190℃ (DMA)● UV阻挡/AOI兼容
● 良好的尺寸稳定性
应用领域
● 适用于智能手机，笔记本电脑，平板电脑，SSD, DDR, 汽车电子，仪表盘，录像机，电视，电子游戏机，通讯设备等
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| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.2 | DMA | ℃ | 190 |
| 2.4.24 | TMA | 165 | ||
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 390 |
|
T288 |
2.4.24.1 | TMA | min |
＞60 |
| T260 |
2.4.24.1 |
TMA |
min |
＞60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 30 |
| After Tg | ppm/℃ | 190 | ||
| 50-260℃ | % | 2.1 | ||
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50 | - | 3.38 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50 |
- | 0.0072 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 3.87×109 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 1.72×107 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 182 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | ＞45 |
|
Peel Strength (H Oz) |
2.4.8 |
288℃/10s |
N/mm |
0.95 |
|
Flexural Strength (LW/CW) |
2.4.4 |
A |
MPa |
510/490 |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.06 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
1. Specification sheet: IPC-4101/130, is for your reference only.2. All the typical values listed above are for your reference only, Please contact Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.