SLF
特点
●优异的耐热性、尺寸稳定性和耐化学性
●低 Dk/Df ●优异的机械性能和电性能
●阻燃性达到 UL94 VTM-0 级
●满足 RoHS 指令要求，不含铅、汞、镉、六价铬、 多溴联苯、多溴联苯醚等
应用领域
电脑、移动电话、数码相机、摄录机、平板显示、仪 器仪表、汽车电子等高端电子产品中
- 产品性能
- 产品证书
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|
items |
method |
Unit
|
IPC Standard |
Typical Value |
|
Peel Strength (90°) |
IPC-TM-650 2.4.9D
|
N/mm |
0.53 | 0.92 |
| surface adhesion(with pure adhesive) |
Q/GDSY 6058.26. 2.4.9.3 |
N/mm |
- | 0.54 |
|
Thermal Stress |
IPC-TM-650,No.2.4.13 |
- |
Pass |
Pass |
| Dimensional Stability | IPC-TM-650,No.2.2.4 Method B | % | ±0.15 |
MD:-0.0682 TD:-0.0585 |
|
Chemical Resistance |
IPC-TM-650,No.2.3.2 |
% | ≥80 | ＞95 |
|
Moisture Absorption |
IPC-TM-650,No.2.6.2 |
% | ≤2 | 0.46 |
|
Volume Resistivity |
IPC-TM-650,No.2.5.17 |
MΩ-cm |
≥106 |
2.54×108 |
|
Surface Resistance |
IPC-TM-650,No.2.5.17 |
MΩ |
≥105 |
3.68×106 |
|
Dielectric Constant |
IEC-61189-2-721 |
- |
≤3.8 |
3.2 |
|
Dissipation Factor |
IEC-61189-2-721 |
- |
≤0.01 |
0.0032 |
|
MIT |
JIS C 6471 R0.38x4.9N |
Times |
- |
＞200 |
| Dielectric Strength |
IPC-TM-650,No.2.5.6.1 |
V/μm |
≥100 |
187 |