SF206B
特点
● 低介电常数，低传输损耗 。
● 与铜箔和PI具有良好的粘结性。
● 不含卤素，阻燃性达到 UL94 V-0 级。
● 优秀的耐热性、耐化学性和电性能。
● 加工性好，适用于传统压合工艺。
● 满足 RoHS 指令要求，不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。
应用领域
高频多层印制板和刚挠多层印制板等用粘接膜- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength (90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.1 |
| 288℃, 5s | 1.1 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
＞90 |
|
Electric Strength |
IPC-TM-650 2.5.6.2A |
D-48/50+D-0.5/23 |
KV/mm |
40.2 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
3.03×109 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
1.92×106 |
| Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 2.52 |
| Dissipation Factor (10GHz) | SPDR | C-24/23/50 | - | 0.0026 |
| Resin Flow | IPC-TM-650 2.3.17.1 |
180℃/10+60s,100kg/cm2 |
mm |
＜0.15 |
|
Flammability |
UL94 |
E-24/125 |
Rating |
V-0 |
Remarks:
*Testing after laminating with shining side of copper foil in suitablecondition.
1.Certified to IPC-4203/24 Unsupported polyimide adhesive
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.