S7040G
特点
● 高Tg 175℃ (DSC)● 低Dk/Df (10GHz, IPC-TM-650 2.5.5.5) 3.72/0.0089
● 更低的Z轴热膨胀系数
应用领域
● 服务器、交换机、基站
● 线卡
- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 185 |
| 2.4.25D |
DSC |
175 | ||
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 405 |
|
T288 |
2.4.24.1 | TMA | min |
≥60 |
| T260 |
2.4.24.1 |
TMA |
min |
≥60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 45 |
| After Tg | ppm/℃ | 245 | ||
| 50-260℃ | % | 2.5 | ||
|
Dissipation Constant |
2.5.5.9 (1GHz) |
C-24/23/50 |
- |
3.90 |
|
2.5.5.5(10GHz) |
C-24/23/50 |
- | 3.72 | |
|
SPDR(10GHz) |
C-24/23/50 |
- | 4.06 | |
|
Dissipation Factor |
2.5.5.9 (1GHz) |
C-24/23/50 |
- | 0.0070 |
|
2.5.5.5(10GHz) |
C-24/23/50 |
- | 0.0089 | |
|
SPDR(10GHz) |
C-24/23/50 |
- | 0.0100 | |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 7.0×107 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 9.0×107 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | >45 |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm [lb/in] | 0.85 [4.86] |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.12 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 (HF) |
Remarks:
1. All the typical value is based on the 0.76mm (6*2116) specimen.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.