S7439
特点
● 高玻璃化转变温度，Tg 190℃（DSC）● Dk/Df@10GHz: 3.66/0.0060 (带状线测试法)
● 高耐性Td>380℃，T300＞60min
● 低Z轴热膨胀系数，优异的通孔可靠性
● 低吸水率及优异的耐湿耐热性能
● 适合无铅工艺制程
应用领域
● 网络设备（路由器、服务器、交换机等)
● 高性能计算机
● 基站背板、子板
- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg |
IPC-TM-650 2.4.24.4 |
DMA |
℃ |
200 | |
|
IPC-TM-650 2.4.25D |
DSC |
℃ |
190 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 383 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
| After Tg | ppm/℃ | 210 | |||
| 50-260℃ | % | 2.6 | |||
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 120 | |
| T300 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 3.85 | |
|
IPC-TM-650 2.5.5.5 |
10GHz | -- | 3.66 | ||
|
IEC 61189-2-721 |
10GHz | -- | 4.05 | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.0045 | |
|
IPC-TM-650 2.5.5.5 |
10GHz | -- | 0.0060 | ||
|
IEC 61189-2-721 |
10GHz | -- | 0.0068 | ||
| Peel Strength (1Oz) |
IPC-TM-650 2.4.8 |
288℃/10s | N/mm [lb/in] | 0.95 [5.43] | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.09 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Remarks:
1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.