S6015
特点
● 不含卤素，无玻纤增强材料，适用于常规HDI制作工艺● 不掉树脂粉，污染少
● 可与常规FR-4.0半固化片媲美的保存期
● 较低的介电常数，有利于特性阻抗控制及提高信号传输速度
应用领域
● 适用于制作无卤化趋势的手持式电子产品，如手机、PDA、数码摄像机等- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.25D |
DSC |
℃ | 145 |
|
Thermal Stress |
2.4.13.1 |
288℃/20s |
- | pass |
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50 | - | 3.4 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50 |
- | 0.018 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 5 x 108 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 5 x 109 |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm | 1.2 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.